Prime Minister Narendra Modi on Wednesday laid the foundation stone of three semiconductor projects worth over ₹1.25 lakh crore via video conferencing. The three projects, each strategically located in different states, signify a comprehensive effort to bolster India’s semiconductor ecosystem and foster innovation in the technology sector.
The foundation stone was laid for three crucial projects: the Semiconductor fabrication facility at the Dholera Special Investment Region (DSIR), Gujarat; Outsourced Semiconductor Assembly and Test (OSAT) facilities at Morigaon in Assam, and Sanand in Gujarat. He also addressed youth across the country on the occasion.
The projects are in line with the prime minister’s vision to position India as a prominent global centre for semiconductor design, manufacturing, and technology development, thereby creating numerous employment opportunities for the country’s youth, according to PMO.
The semiconductor fabrication facility at the Dholera Special Investment Region (DSIR) will be established by Tata Electronics Private Limited (TEPL) under the Modified Scheme for setting up semiconductor fabs in India. With an investment exceeding Rs. 91,000 crore, this will mark the inauguration of the country’s first commercial semiconductor fab.
The Outsourced Semiconductor Assembly and Test facility in Morigaon will be developed by Tata Electronics Private Limited (TEPL) under the Modified Scheme for Semiconductor Assembly, Testing, Marking, and Packaging (ATMP), with an investment of about ₹27,000 crore. The OSAT facility in Sanand will be established by CG Power and Industrial Solutions Limited under the Modified Scheme for Semiconductor Assembly, Testing, Marking, and Packaging (ATMP), with an investment of approximately ₹7,500 crore. These initiatives will fortify the semiconductor ecosystem in India, providing a solid foundation for its growth.
